HDI PCB

HDI boards are becoming evermore popular and require special processes and equipment to match the high spec technology of these boards.

HDI boards contain blind and/or buried vias and often contain micro vias of .006 or less in diameter. There are 6 main types of HDI boards, through vias, blind & buried vias, two or more HDI layer with through vias, passive substrate, coreless construction and alternate constructions.

Technologies

  • Plated Through Hole (PTH) & Multilayer
  • Ionic Test Report
  • Blind & Buried Vias inc. Filled and Plated Over
  • High Aspect Ratio Plating
  • High Density Interconnect (HDI)
  • Sequential Build Technology
  • High Copper Weight for inner & outer layers
  • Impedance & Inductance Testing

Materials

  • FR4
  • Arlon
  • Rogers
  • Taconic
  • Anti-CAF
  • High Tg

Finishes

  • HASL
  • ENIG
  • OSP
  • SILVER
  • Tin
  • Palladium
  • Carbon