PCB Capabilities
Technologies
- Conventional
- Plated Through Hole (PTH) and Multi Layer
- Ionic Test Reports
- Blind & Buried Vias inc. Filled & Plated Over
- High Aspect Ratio Plating
- High Density Interconnect (HDI)
- Sequential Build Technology
- High Copper Weight for inner & outer layers
- Thermal Management
- Impedance & Inductance Testing
Materials
- FR4
- Polyimide
- Arlon
- Rogers
- IMS (Aluminium, Copper Board)
- Taconic
- Anti-CAF
- High Tg
- Ceramic
Finishes
- HASL
- OSP
- SILVER
- ENIG
- Tin
- Palladium
- Carbon
