PCB Capabilities

Technologies

  • Conventional
  • Plated Through Hole (PTH) and Multi Layer
  • Ionic Test Reports
  • Blind & Buried Vias inc. Filled & Plated Over
  • High Aspect Ratio Plating
  • High Density Interconnect (HDI)
  • Sequential Build Technology
  • High Copper Weight for inner & outer layers
  • Thermal Management
  • Impedance & Inductance Testing

Materials

  • FR4
  • Polyimide
  • Arlon
  • Rogers
  • IMS (Aluminium, Copper Board)
  • Taconic
  • Anti-CAF
  • High Tg
  • Ceramic

Finishes

  • HASL
  • OSP
  • SILVER
  • ENIG
  • Tin
  • Palladium
  • Carbon